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Important Dates
  • Paper submission due:

    February 15, 2027

  • Paper acceptance due:

    March 15, 2027

  • Registration deadline:

    April 15, 2027

  • Conference date:

    May 21-23, 2027

Organization
  • Organizer:

    Dalian Jiaotong University

  • In Association With

    Beijing University of Technology

    Chengdu University of Information Technology

    School of Electrical Engineering and Information, SouthWest Petroleum University

    School of Software, Nanchang Hangkong University

    Key Laboratory of Jiangxi Province for Image Processing and Pattern Recognition

    School of Software, Taiyuan University of Technology

  • General Chair:

    Carlos M. Travieso-González, University of Las Palmas de Gran Canaria, Spain

    Ljiljana Trajković, Simon Fraser University, Canada

    Yufei Ma, Harbin Institute of Technology, China

  • Co-Chair:

    Jun Liu, Chengdu University of Information Technology, China

    Samuel Fosso Wamba, TBS Education, France

    Shunli Wang, Inner Mongolia University of Technology, China

    Sos S. Agaian, City University of New York, USA

    Yu-Dong Zhang, Southeast University, China

Contact US
Speakers

Lingfeng Shi

Prof. Lingfeng Shi received the B.Eng. degree in Radio Engineering from China Institute of  Metrology (now China Jiliang University) in 1995, the M.Eng. degree in  Circuits and Systems from Xidian University in 2003, and the Ph.D.  degree in Circuits and Systems from Xidian University in 2008. His  current research interests include sensor signal processing, positioning  and navigation, wireless communications, and integrated circuit design.  He has published over 130 journal papers, including more than 100 in  academic journals and over 20 in domestic and international conference  proceedings. Among them, over 90 papers are indexed by SCI (nearly 20 in  Q2 or above, and 30 in IEEE journals), more than 10 by EI, and over 20  by ISTP. He holds 21 authorized national invention patents, 1 authorized  utility model patent, has filed 6 national invention patent  applications, and has successfully transferred 2 invention patents. He  is currently a Senior Member of IEEE. He serves as a reviewer for more  than 20 prestigious SCI-indexed international academic journals.